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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS PC2800A PREAMPLIFIER FOR INFRARED REMOTE CONTROL DESCRIPTION The PC2800A is a receiver preamplifier for infrared remote control systems. It can be directly connected to a PIN photodiode and integrates a high-gain first-stage amplifier, limiter, bandpass filter, detection circuit, and waveform shaping circuit to provide a receiver preamplifier on a single chip. FEATURES * High reliability due to high-frequency lighting fluorescent lamp Internal trap circuit * Internal bandpass filter Central frequency variable by external resistor: fO = 30 to 80 kHz Few variation of central frequency thanks to fO trimming * Low external components Internal output pull-up resistor and power supply filter resistor Only low external capacitance required * ABLC (Automatic Bias Level Control) circuit Controls fluctuation of bias level cause by disturbance from external light * Open-collector output Open-collector output (active low) with pull-up resistor (33 k TYP.) ORDERING INFORMATION Part Number Package 8-pin plastic SOP (225 mil) PC2800AGR The information in this document is subject to change without notice. Document No. S12974EJ6V0DS00 (6th edition) Date Published October 1998 N CP(K) Printed in Japan The mark shows major revised points. (c) 1992 PC2800A BLOCK DIAGRAM + R2 4 3 CS VCC fO VCC2 RS 47 1 VCC1 IN+ 8 First stage amplifier Limiter BPF + TRAP Detection circuit RL 33 k Waveform shaping circuit OUT 2 Output ABLC PIN photodiode 7 R1 C2 C1 IN- GND 5 CD 6 PIN CONFIGURATION (Top View) 8-pin plastic SOP (225 mil) * PC2800AGR VCC1 OUT VCC2 fO 1 2 3 4 8 7 6 5 IN+ IN- CD GND Pin No. 1 2 3 4 5 6 7 8 Symbol VCC1 OUT VCC2 fO GND CD IN - IN + Pin Name Power input pin Output pin Power output pin BPF frequency setting pin Ground pin Detection capacitor connection pin First-stage amplifier gain setting pin Signal input pin 2 PC2800A 1. PIN FUNCTION Pin No. 1 Symbol VCC1 Pin Name Power input pin Internal Equivalent Circuit Function Supply a voltage of 5 V 10% to this pin. If the IC malfunctions due to power noise, connect a bypass capacitor. VCC1 An open-collector output pin (active low) with a pull-up resistor (33 k TYP.) Connect an external pull-up resistor of 2.2 k or more, if any, to this pin. 2 OUT Output pin 33 k 2 Output transistor From waveform shaping circuit 3 VCC2 Power output pin VCC1 Connect a capacitor of 47 F or so to this pin to stabilize the supply voltage to the internal circuit. 3 Internal circuit power line 4 fO BPF frequency setting pin 4 fO setting block of BPF Trimming resistor Sets the central frequency of the internal bandpass filter by an external resistance (refer to fO vs. R2 Characteristics in CHARACTERISTIC CURVE). Use a resistor with excellent accuracy and temperature characteristics. 5 6 GND CD Ground pin Detection capacitor connection pin Waveform shaping circuit GND pin Connect a smoothing capacitor to this pin to obtain a DC voltage corresponding to the output signal level of the internal bandpass filter. The 0.01 F is the most suitable value for the external capacitor between pin 6 and GND. In case of reducing this capacitor, confirm that the output pulses from pin 2 have enough width even if the longest burst signal is inputted. 6 BPF output signal 3 PC2800A Pin No. 7 Symbol IN - Pin Name First-stage gain setting pin Internal Equivalent Circuit Function Reverse input pin of the first-stage amplifier. Connect a capacitor (0.01 F) to prevent direct current so that the firststage amplifier operates as an AC amplifier. The gain of the amplifier can be adjusted by an external resistor (0 to 1 k) (refer to AV vs. R1 Characteristics in CHARACTERISTIC CURVE). This pin has an internal impedance of 90 k (TYP.) and can be directly connected to a PIN photodiode. Because this is the input pin of a highsensitivity amplifier, exercise care that noise is not superimposed on this pin. Keep the wiring length of the cathode of the PIN photodiode as short as possible. 2.5 V 90 k ABLC 7 8 IN + To limiter circuit Signal input pin 8 4 PC2800A 2. EXAMPLE OF MEASURES TO PREVENT MALFUNCTIONING DUE TO NOISE 2.1 Radiation noise * Keep the wiring length between the PIN photodiode and pin 8 as short as possible. * Keep the signal lines of pins 2 and 6 as far away as possible from those of pins 7 and 8. * Commonly ground the anode of the PIN photodiode and the external capacitor connected to pin 7. Separate the GND and power GND of pin 6 from these. * Cover the entire circuit in a shield case. 2.2 Power noise * Monitor the noise superimposed on pin 3 with an oscilloscope. If high-frequency noise is superimposed, connect a ceramic capacitor of 0.1 F or so between pin 3 and GND. a capacitor between pin 1 and GND. 2.3 External light disturbance noise * Use a PIN photodiode with an excellent spectral sensitivity. * Use a PIN photodiode with a lens and with a narrow directional angle. 2.4 Noise * Insert an external resistor (R1: 1 k or less) in series to C1 between pin 7 and GND to decrease the voltage gain. In this case, however, the distance is shortened and care must be exercised not to decrease the voltage gain too much. If low-frequency noise is superimposed, increase the capaciance of the capacitor between pin 3 and GND. If necessary, connect 3. NOTICE FOR USE The PC2800A is designed for the infrared remote control receivers of audio-visual equipment, air conditioner and so on. Therefore the PC2800A may not be suitable for some applications that require accurate pulse widths such as data communications. In case of using the PC2800A under the accurate pulse width condition, confirm that the output pulses from pin 2 have enough accuracy in actual environmental changing (refer to the following examples). Example of environmental changing: Operating ambient temperature, supply voltage, external disturbing light, external noise, input burst length, input carrier frequency, strength of input light, direction of input light, distance from transmitter, characteristics of parts (including the PC2800A) and so on. 5 PC2800A 4. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings (TA = 25 C) Parameter Supply voltage Output current Input voltage Permissible package loss Operating temperature Storage temperature Symbol VCC IOUT VIN PD TA Tstg Rating 6.0 2.5 0 to VCC 270 -20 to +75 -40 to +125 Unit V mA V mW C C Caution If any of the parameters exceeds the absolute maximum ratings, even momentarily, the quality of the product may be impaired. The absolute maximum ratings are values that may physically damage the product(s). Be sure to use the product(s) within the ratings. Recommended Operating Range Parameter Supply voltage Input frequency Symbol VCC fIN MIN. 4.5 30 TYP. 5.0 38 MAX. 5.5 80 Unit V kHz Electrical Characteristics (TA = 25 C, VCC = 5.0 V) Parameter Supply current Input pin voltage Input pin voltage Voltage gain BPF bandwidth Internal input resistance Output pulse width 1 Output pulse width 2 Low-level output voltage High-level output voltage Symbol ICC VIN1 VIN2 AV fBW rIN tPW1 tPW2 VOL VOH 4.8 IIN = 0 IIN = -300 A fIN = 38 kHz CW, VIN = 30 Vp-p -3 dB bandwidth, VIN = 30 Vp-p, R2 = 130 k fIN = 38 kHz CW, VIN = 0.2 Vp-p fIN = 38 kHz burst wave, VIN = 500 fIN = 38 kHz burst wave, VIN = 50 2.0 0.6 74 2.0 60 Condition MIN. TYP. 2.1 2.5 0.8 78 2.5 90 MAX. 2.8 3.1 1.7 82 3.0 140 770 770 0.2 5.0 0.4 Unit mA V V dB kHz k Vp-pNote mVp-pNote 440 440 s s V V Note Input burst wave 600 s 600 s Output pulse width tPW 38-kHz carrier 6 PC2800A CHARACTERISTIC CURVE (TA = 25 C) ICC vs. VCC Characteristics 5 100 R2 = 130 k AV vs. fIN Characteristics 4 Supply current ICC (mA) 80 Voltage gain AV (dB) 3 60 2 40 1 20 0 3.5 4 4.5 5 5.5 6 6.5 0 30 40 Input frequency fIN (kHz) 50 Supply voltage VCC (V) fO vs. R2 CharacteristicsNote 1 85 80 VCC = 5.0 V Note 1. The relation between fO and R2 (recommended value) is as follows: fO (kHz) 32.7 R2 (recommended value) (k) 155 139 136 130 123 80 60 Central frequency fO (kHz) 70 60 50 40 36.0 36.7 38.0 40.0 56.7 30 25 40 60 80 100 120 140 160 180 70.0 Frequency setting resistor R2 (k) AV vs. R1 CharacteristicsNote 2 80 Note 2. This is the value of a resistor that is externally connected as follows: 5V 130 k + 47 F 3 Voltage gain Av (dB) f = 38 kHz VIN = 30 Vp-p 75 1 4 +8 0.47 F 51 7 R1 PC2800A 5 6 VO 70 0 Voltage gain = VO VIN 0.5 External resistor of pin 7 R1 (k) 1.0 0.01 F 1 M 7 PC2800A 5. APPLICATION CIRCUIT EXAMPLE (fO = 38 kHz) 0.01 F PIN photodiodeNote 0 to 1 k 8 IN+ 7 IN- 6 CD 0.01 F 5 GND VCC1 1 OUT 2 VCC2 3 fO 4 Supply voltage: +5 V Output 130 k + 47 F Note PH302, 302C, 310, 320, etc. 8 PC2800A 6. PACKAGE DRAWINGS 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end P 1 A 4 H F G I J S B E D NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. L K N S C M M ITEM A B C D E F G H I J K L M N P MILLIMETERS 5.2 +0.17 -0.20 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.10.1 1.590.21 1.49 6.50.3 4.40.15 1.10.2 0.17 +0.08 -0.07 0.60.2 0.12 0.10 +7 3 -3 S8GM-50-225B-5 9 PC2800A 7. RECOMMENDED SOLDERING CONDITIONS Solder this product under the following recommended conditions. For details of the recommended soldering conditions, refer to information document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended, consult NEC. Surface Mount Type PC2800AGR: 8-pin plastic SOP (225 mil) Process Infrared ray reflow Conditions Peak temperature: 230 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 1 time. Peak temperature: 215 C or below (Package surafce temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 1 time. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Pin temperature: 300 C or below, Heat time: 3 seconds or less (Per each side of the device). Symbol IR30-00-1 VPS VP15-00-1 Wave soldering WS60-00-1 Partial heating method - Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. 10 PC2800A [MEMO] 11 PC2800A [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 |
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